Tapuni fa'asalalauga

O loʻo faʻamoemoe Samsung e taulaʻi atili i faʻatauga i le isi tolu tausaga e teteʻe ai le osofaʻiga a faʻailoga tauva ma faʻateleina lona tuputupu aʻe i le lumanaʻi. Na taʻua e sui o le South Korean tech giant lenei mea i le taimi o se fonotaga faʻatasi ma tagata teu tupe. I le taimi lava e tasi, sa latou tuuina atu muamua le taunuuga tau tupe a le kamupani mo le kuata mulimuli o le tausaga talu ai.

O le faʻatauga tele mulimuli a Samsung na faia i le 2016, ina ua faʻatauina le sauai Amerika i le fanua o leo ma fesoʻotaʻi taʻavale HARMAN International Industries mo 8 piliona tālā (e tusa ma le 171,6 piliona pale).

Ua uma ona faʻasalalau e isi tagata taʻutaʻua tele a latou faʻatauga sili mulimuli i le tausaga talu ai: AMD na faʻatau Xilinx mo le $ 35 piliona (pe tusa CZK 750,8 piliona), Nvidia faʻatau ARM Holdings mo le $ 40 piliona (i lalo ifo o le CZK 860 piliona) ma SK Hynix maua lana pisinisi SSD mai Intel mo $9 piliona (e tusa ma le CZK 193 piliona).

E pei ona iloa, o Samsung o loʻo numera tasi i le DRAM ma NAND vaega manatua, ma e faʻavae i luga o lenei mea, o loʻo faʻamoemoe le au suʻesuʻe o le isi ana mauaina tele e avea ma kamupani mai le semiconductor ma logic chip sector. I le tausaga na teʻa nei, na faʻasalalau ai e le kamupani e manaʻo e avea ma kamupani sili ona tele semiconductor i le lalolagi i le 2030 ma o le a tuʻu ese le 115 piliona tālā (i lalo ifo o le 2,5 trillion pale) mo lenei faʻamoemoe. E faapena foi fuafua e fau o lona fale gaosi chip i Amerika.

O aso nei e sili ona faitau

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